ISMAIL, I.I.; ISMAIL, A.K.; RIDUAN, S.S.; AZID, I.A; SHAMSUDDIN, K.A. Temperature Distribution Analysis during Solidification Process in Reflow Machine for Printed Circuit Board. Politeknik & Kolej Komuniti Journal of Engineering and Technology, Putrajaya, Malaysia, v. 8, n. 1, p. 72–82, 2023. Disponível em: https://app.mypolycc.edu.my/journal/PMJET/article/view/362. Acesso em: 6 sep. 2025.