ISMAIL, I.; ISMAIL, A.; RIDUAN, S.; AZID, I.; SHAMSUDDIN, K. Temperature Distribution Analysis during Solidification Process in Reflow Machine for Printed Circuit Board. Politeknik & Kolej Komuniti Journal of Engineering and Technology, Putrajaya, Malaysia, v. 8, n. 1, p. 72–82, 2023. Disponível em: https://app.mypolycc.edu.my/journal/index.php/PMJET/article/view/362. Acesso em: 23 nov. 2024.