Ismail, I.I., A.K. Ismail, S.S. Riduan, I.A Azid, and K.A. Shamsuddin. 2023. “Temperature Distribution Analysis During Solidification Process in Reflow Machine for Printed Circuit Board”. Politeknik & Kolej Komuniti Journal of Engineering and Technology 8 (1). Putrajaya, Malaysia:72-82. https://app.mypolycc.edu.my/journal/index.php/PMJET/article/view/362.